Diamond wire saws available from Princeton Scientific are designed for simple, menu-guiding operation. Only high-quality industrial parts were used for the drive, touch controls, sensors and electrics. The housing and the attachments of our saws are made of stainless steel and anodized aluminum. Different diamond wires as well as various … Read More
Precision wire saws available from Princeton Scientific have been developed with an improved cutting technique that utilizes the precision guidance of the with and uniform application of an abrasive slurry. This results in: Surface quality is almost ‘lapped’ quality Cutting that does not introduce deformations Minimal loss of material from cutting … Read More
The diamond wire saw DWS.375E (endless) is currently our largest one-way saw in vertical design. The maximum workpiece cutting area is T375xH375 mm. Diamond wire loops with a length of 3000 mm and thicknesses from 0.35 to 0.80 mm are used. The continuously adjustable wire speed goes from 4 to … Read More
The diamond wire saw DWS.250E (endless) is a one-way table saw in vertical design. The maximum workpiece cutting area is 250×250 mm. Diamond wire loops with a length of 2000 mm and thicknesses from 0.35 to 0.60 mm are used. The continuously adjustable wire speed goes from 4 to 12 … Read More
The DWS.250 type diamond wire saw is currently our largest two-way vertical table saw. The maximum workpiece cutting area is 250×250 mm and the recommended diamond wire thickness is 0.20 to 0.50 mm. The continuously adjustable wire speed goes from 0 to 4 m/s. To ensure a constant cutting pressure, … Read More
The diamond wire saw type DWS.175 is a table saw in vertical design. The maximum workpiece cutting area is 175 x 175 mm and the recommended diamond wire thickness is 0.15 to 0.50 mm. The continuously adjustable wire speed goes from 0 to 4 m/s. To ensure a constant cutting … Read More
The diamond wire saw type DWS.100 is a table saw in horizontal design so that the smallest cut-offs can be observed with the naked eye or also by means of an attached microscope. The maximum workpiece cutting area is 90 x 90 mm and the recommended diamond wire thickness is … Read More
The WS25B Wire Saw is a precision device for cutting or slicing hard and brittle materials, such as metals, ferrites, ceramics, stones etc. In particular, it is useful for cutting semiconducting materials. The wire saw enables cutting of very thin slices (thickness of 10um) with smooth cut surfaces. This saw … Read More
PSC Stereomicroscope Application The PSC Stereomicroscope, with a wide visible field, is designed for stereoscopic observation of samples with the use of changeable magnification. Microscope is equipped with its own power supply for regulation of light and table for cross light observation. Technical Data Magnification: • with 10x eyepiece • … Read More
Application and General CharacteristicsThe Vacuum Sample Holder is designed to use a vacuum to hold a 4 x 6 cm glass plate, on to which samples are fixed with wax. The glass plate is held against a stainless support plate with vacuum and is placed firmly against 3 locating pins … Read More
WSXC-20 Optical Orientation Device Application The WSXC 20 Optical Orientation Device is used to determine the orientation of a crystal or to align a crystal so the specifically oriented surface can be cut. General Characteristics WSXC 20 optical orientation device is a set consisting of: 0.5 mW laser beam source … Read More
WSXC-10 X-Ray Laue CameraApplicationThe WSXC-10 camera is used for the orientation of single crystal samples where cutting along strictly determined crystallographic planes isrequired.General CharacteristicsWSXC10 camera is designed to hold crystals in the process of determining crystallographic orientation using Laue back reflection. The diffracted beams are registered by the wet film … Read More
WSG-01 GoniometerApplication:The WSG 01 goniometer is designed for specimen orientation when cutting along desired direction is required. General Characteristics:The WSG 01 goniometer is used to hold samples in the process of orientation using scale or different methods such as Laue photo, laser beam reflection, optical method and than cutting on high precision … Read More
ApplicationThe MS-80 multi-band saw is a precision device for cutting or slicing hard and brittle materials such as metals, ferrites, ceramics, stones, etc. In particular, the MS-80 multi-band saw is useful for cutting semiconducting materials. This multi-band saw enables cutting of very thin slices (a thickness of 50mm) with smooth … Read More
WS-25 High Precision Wire Saw with Electronic Sample Support Thanks to innovative design, the WS-25 wire saw is first wire saw that can cut with free abrasive method as well as with diamond dotted wire. The WS-25 wire saw is fitted with an adjustable sample support with electronic vertical axis. … Read More
ApplicationThe WS-22B High Precision Wire Saw has stronger horizontal support than the WS-22 and includes ball bearings on both sides. This allows the wire saw to cut samples of larger dimensions and weight.The WS-22B wire saw has been developed to meet two important requirements: 1) cutting should not introduce deformations … Read More
ApplicationThe WS-22 wire saw has been developed to meet two important requirements: 1) cutting should not introduce deformations or defects, and 2) loss of material should be minimized. These two requirements have been met by the development of an improved cutting technique which utilizes the precision guidance of the wire … Read More